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Capacitive Sensor Printed Flexible Circuit Board
Flexible Printed Circuit Board mean FPC or Flexible Circuit Board.
It is a printed circuit made of a flexible insulating substrate.
Printed Flexible Circuit Board has many advantages that a rigid printed circuit board does not have.
For example, it can be freely bent, wound, folded, can be arbitrarily arranged according to the spatial layout requirements. Also, it can be arbitrarily moved and expanded in a three-dimensional space.
Thereby achieving integration of component assembly and wire connection.
The use of FPC can greatly reduce the volume of electronic products. In addition, it is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability.
Therefore, FPC has been widely used in many areas. For example, aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, digital cameras and other fields or products.
FPC also has the advantages such as good heat dissipation, solderability, easy assembly, and low overall cost etc .
The design of soft and hard combination also compensates for the slight shortage of flexible substrate in the bearing capacity of components.
Flexible Printed Circuit boards are available in single-sided, double-sided and multi-layer boards.
The substrate used is mainly a polyimide copper clad laminate. The material has high heat resistance and good dimensional stability. So it is formed into a final product by pressing with a cover film having both mechanical protection and good electrical insulation properties. The surface and inner conductors of the double-sided, multi-layer printed wiring board are electrically connected to each other through metallization.
Capacitive Sensor Printed Flexible Circuit Board
Flexible Printed Circuit Board mean FPC or Flexible Circuit Board.
It is a printed circuit made of a flexible insulating substrate.
Printed Flexible Circuit Board has many advantages that a rigid printed circuit board does not have.
For example, it can be freely bent, wound, folded, can be arbitrarily arranged according to the spatial layout requirements. Also, it can be arbitrarily moved and expanded in a three-dimensional space.
Thereby achieving integration of component assembly and wire connection.
The use of FPC can greatly reduce the volume of electronic products. In addition, it is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability.
Therefore, FPC has been widely used in many areas. For example, aerospace, military, mobile communications, laptop computers, computer peripherals, PDAs, digital cameras and other fields or products.
FPC also has the advantages such as good heat dissipation, solderability, easy assembly, and low overall cost etc .
The design of soft and hard combination also compensates for the slight shortage of flexible substrate in the bearing capacity of components.
Flexible Printed Circuit boards are available in single-sided, double-sided and multi-layer boards.
The substrate used is mainly a polyimide copper clad laminate. The material has high heat resistance and good dimensional stability. So it is formed into a final product by pressing with a cover film having both mechanical protection and good electrical insulation properties. The surface and inner conductors of the double-sided, multi-layer printed wiring board are electrically connected to each other through metallization.
